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     Amicra SDB

Semi Automatic High Accuracy Micro Assembly Cell

 

 

     Key Features

  • 1M Placement accuracy
  • Cycle time <60sec
  • Flip-Chip option
  • Assembly of chip & micro-optics
    • WDM, optoelectronic components, micro-lenses, micro-mechanics
  • Die sorting
  • Wafer Mapping
  • Eutectic bonding via diode-laser
  • Epoxy stamping & dispensing
  • Active / Passive alignment
  • Active bond force control
  • Post bond inspection
  • Modular machine concept

 

Bond Force Control
  • Closed loop control with position sensor

  • Working area

    • 3-100cN / 0.5cN resolution

    • 1-25 cN / 0.2 cN resolution

  • Touch down sensor

Flip-Chip Option

 

  • Massive, web-cast frame

  • Superior vibration attenuation

  • Rigid microscope bridge

Amicra SDB brochure (PDF)

 

Contact Paul Bampton for further information


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PDP Equipment Ltd 2012