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     Amicra NovaPlus

High Speed Dual Head Die Bonder

 

 

     Key Features

  • UPH up to 4000 (10M @ 3sigma, including Flip-Chip)
  • UPH up to 1200 (3M @ 3sigma, including Flip-Chip)
  • Flip-Chip & Die Attach options
  • Automatic load of Wafer & Substrate
  • Dynamic alignment
  • Eutectic bonding via diode-laser or heating plate & hot bond tool
  • Epoxy stamping & dispensing options
  • Micro dispensing; dot size up to 150M
  • Wafer mapping
  • Active bond force control
  • Post bond inspection
  • Wafer mapping
  • Modular machine concept
  • Easy configure software

 

 

 

Amicra NovaPlus Video          Amicra NovaPlus Datasheet (PDF)

 

Contact Paul Bampton for further information


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PDP Equipment Ltd 2012