SST International

Model 5100
High Production Programmable Vacuum/Pressure Furnace

Increased Thermal Work Zone 144 in² (930cm²) over 3130

• Fluxless Soldering

• MMIC Die Attach

• Power Module Assembly

• Automotive Device Assembly

• Hermetic Package Sealing

• Fiber Optic Packaging

• Hybrid Assembly

• High Intensity LED Attach

• Eutectic Die Attach

• PV Solar Cell Assembly

• Flip Chip Soldering

• Lead-Free Soldering

MODEL 3130
Programmable Vacuum/Pressure Furnace

• Flux-Free Solder Process Development

• University or Laboratory Research

• Low Volume Assembly of Microelectronic Packages

• Void-Free Eutectic Die Attach

• Hybrid Microelectronic Circuit Assembly

• Fiber Optic Package Assembly

• Ceramic Package Sealing

Models 3140/3150
High Vacuum Furnace

Graphite Tooling

• Activate Getters and Seal MEMS Packages
• Solder, Braze or Glass Seal Packages in High Vacuum Environment
• Seal Packages with High Purity Gasses
• Low Moisture Package Sealing
• Laboratory and Production Tool

• Resistively Heated
• Holding/locating Device
• Isotropic Material
• Uniform Temperature
• Conductive Heating
• Coated to Eliminate Particles
• Graphite Has The Merit of “Mopping Up” Oxygen in an Oxidizing Atmosphere