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Norcom 2020 & 2020SF

Optical Leak Test Systems


  • Quantitative results measured in cc-atm/second helium

  • One-step calibration and setup

  • Simultaneously tests for fine and gross leaks

  • Tests variety of hermetically sealed devices, including PC board-mounted and pig-tailed packages

  • Provides Statistical Process Control (SPC) for tracking of test results

  • MIL STD approved

Norcom 2020


Norcom 2020SF (Single Footprint)


Norcom 410

Optical Gross Leak Test System


  • The Norcom 410 saves you time, expense and risk. It replaces bubble leak testing, eliminates polluting fluorocarbons, helium for mass spectroscopy, and radioactive Krypton tracer gases for parts bombing. It eliminates pollution, radiation, and the cost of consumables.

    The bench-top system is suitable for almost any electronics production environment. Self-contained it includes everything you need for testing in one package. A barcode reader for data entry and LAN connectivity are available as options.

Norcom 410

Dimensions 20.0 x 8.0 x 9.5
Weight 25 lbs.
Power 100-220 VAC
50/60 Hz.
Max. Part Size 3x4x2 inches
Typical Test Time 10 seconds/part

Gross Leak Tests for:
Metal Lid Packages
Ceramic Lid Devices
Si Lid Devices
Fiber Optic Devices

Electronic packages for:


  The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.

Since the reliability of hermetic electronic packages is dependent on the detection of gross and fine leaks, the NorCom 2020's pinpoint accuracy, repeatability and increased production throughput make the system an essential requirement for hermetic device production.

The NorCom 2020 provides quantitative leak test results in the industry standard of cc-atm/second helium. The system is ideal for optoelectronic, semiconductor and PC board-mounted devices for military, aerospace and telecommunication applications.





  • Military / Hi-Rel

  • Microelectronics

  • Optoelectronics

  • Microwave

  • PC board-mounted devices


  • Reliable and repeatable test results
  • No helium mass spectroscopy or bubble testing
  • Increases production throughput
  • Improves packaging process control
  • Eliminates back-end production bottlenecks
  • Minimal training required.



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PDP Equipment Ltd 2013