PDP Home

 

          5832 Semi-Automatic Deep Access Fine Wire Wedge Bonder

 

      5832 Semi-Automatic Deep Access Fine Wire Wedge Bonder
  • The deep access fine wire Wedge version of the automatic wire bonders in our 58xx Series featuring exchange able bond heads.

  • A fully automatic mode makes it ideally suited for medium-scale production.

  • Parts to be bonded are fed manually by the operator, but the bonds are produced completely without operator influence. Thanks to the built-in pattern recognition (optional).

  • Single bonds can be made within seconds, making the machine perfect for R&D, Pilot manufacturing and mid volume production.

 

                                                      

 

  Bondtec 5832 Datasheet

 

58xx Video

5832 Deep Access Fine Wire Wedge Bonder Specifications

Wire types

 

Aluminium & Gold wire 17,5 … 75 μm on 2” spool

Ribbon 30µm x 12.5µm - 250µm x 25µm

Motorised wire spool (optional)

Bondhead Wedge-Wedge for fine wire & ribbon

Standard wedges, 1" length, 0.750" optional 90° wire feed

Ultrasonic system 

F&K Generator 60 kHz /100 kHz

(further frequencies on request)

Axes

Working area X/Y-axis 200 x 150 mm; step resolution 0,3 μm

Programmable Z axis with 100 mm stroke; step resolution 0,3 μm

Hardware

Dual-Core PC with Windows 7 OS

Ethernet, USB 2.0/3.0

LCD Colour Display 22”

GigE-CCD-Colour Camera, 5 Mpixel

Fully networkable in TCP/IP servers for program archiving

Software

From single bonds up to complex programmes

Step & Repeat

Loop shapes can be stored in libraries

Optionally: pattern recognition with pseudo-error check

Dimensions

W x D x H 92 x 71 x 65 cm, weight approx. 80 kg

Connections

100 - 240 VAC, single phase, 50/60 Hz, max. 230 VA
6mm Ø standard vacuum tubing

Workholder heater control

Integrated, 0 - 300°C

 

 


Top of Page

© PDP Equipment Ltd 2016