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          5650 Semi-Automatic Heavy Wire Wedge Bonder

 

      5650 Semi-Automatic Heavy Wire Wedge Bonder
  • The automatic and semi-automatic Heavy Wire Wedge Bonder 5650 is fully PC controlled and allows any number of bonds to be programmed. Pre-programmed adjust points are targeted through the camera's cross-hair targeting system (Pattern Recognition System optional) and the programmed bonds are executed automatically.

  • Two operating modes are available; Single bond for repair of various bond samples and making single bonds (manual-automatic) and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).

  • The 5650 is part of the 56xx family which consists of a base machine plus a bondhead for each of your required processes. As such it can also be used as a 30°/45° wedge, deep access wedge, ball, or heavy ribbon bonder as well as pull-/shear tester by simply replacing the bondhead and loading the appropriate software. Set-up time approx. 5 minutes.

 

 
 
 

5650 Wedge Bonder Specifications

XY Table

Working area: 100 x 100mm (4" x 4")

Resolution 0.25 μM, repeatability < 2 μM

 

  Bondtec 5650 Datasheet

56xx Video

Z Axis 60mm
Speed

All axes programmable from 0.2 - 16mm/s

30 wires / minute

 

Wire types

Aluminium wire; 100 - 500μM on 2" spool

 

Bondhead

Rotating ±360°

90° wire feed angle

Wedge length; 2"

57KHz Ultrasonics

90° quick-change wire guide and cutter

Bond force; programmable from 100g - 1000g

 

Computer

Single Board PC, 600 MHz Pentium processor, 256 MB RAM

Ethernet, USB, 4 x rear + 4 x front

Monitor, 15" TFT Flat Screen

Operating System: Windows 2000®

 

Lighting

20W Halogen spotlight and LED direct light

 

Workholder

Standard 2" x 2", mechanical clamping

4" x 4" optional, also with vacuum

 

Dimensions

Height: 700mm, Width: 700mm, Depth: 650mm. Weight approx. 70kg

 

 


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