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          5610 Semi-Automatic Ball Bonder

 

      5610 Semi-Automatic Ball Bonder
  • The automatic and semi-automatic Gold Ball Bonder 5610 is fully PC controlled and allows any number of bonds and bumps to be programmed. Pre-programmed adjust points are targeted through the camera's cross-hair targeting system (Pattern Recognition System optional) and the programmed bonds or bumps are executed automatically.

  • Two operating modes are available; Single bond for repair of various bond samples and making single bonds (manual-automatic) and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).

  • The 5610 is part of the 56xx family which consists of a base machine plus a bondhead for each of your required processes. As such it can also be used as a fine wire Wedge (30°/45° or 90°), heavy wire or heavy ribbon bonder as well as pull-/shear tester by simply replacing the bondhead and loading the appropriate software. Set-up time approx. 5 minutes.

 

 
 
 

5610 Ball Bonder Specifications

XY Table

Working area: 100 x 100mm (4" x 4")

Resolution 0.25 μM, repeatability < 2 μM

 

  Bondtec 5610 Datasheet

56xx Video

 

Z Axis 60mm
Speed

All axes programmable from 0.2 - 16mm/s

30 wires / minute

 

Wire types

Gold wire; 17.5 - 50 μM on 2" spool

 

Bondhead

Gold Ball

Negative Electronic Flame Off

60 KHz Ultrasonics standard, 100 KHz optional

 

Computer

Single Board PC, 600 MHz Pentium processor, 256 MB RAM

Ethernet, USB, 4 x rear + 4 x front

Monitor, 15" TFT Flat Screen

Operating System: Windows 2000®

 

Lighting

20W Halogen spotlight and LED direct light

 

Workholder

Digitally controlled heated stage

Standard Ø - 60 mm for samples to 2" x 2", mechanical clamping

4" x 4", 80 mm & optional, also with vacuum (4" x 4” up to 200°C, 80mm up to 250°C)

 

Dimensions

Height: 700mm, Width: 700mm, Depth: 650mm. Weight approx. 70kg

 

 


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