53xx BDA Manual Universal Fine Wire
& Die Bonder
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The 53xx BDA offers two bond processes in one machine. Gold ball bonding and deep-access wedge bonding. Switching over could not be simpler, just flip the flame-off unit up, insert the wire clamp and replace the bond capillary with a wedge and you are ready to go.
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The second unique feature of the 53XX BDA is the built-in motorized Y-axis. It is fully programmable and produces an entire bond loop, complete with programmable tear-off function and tail definition. Especially for miniaturized microwave bonds, this guarantees perfectly reproducible bonds with no operator influence. Even for thicker wires, the cascading clamp system with one clamp above the wedge and a second clamp at the wedge foot ensures that the wire tear-off is reliable and constant.
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Complicated loop forms including reverse loops or stitch bonds are easily executed with minimum operator influence.
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Ball bumping capability.
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Our proprietary Ultrasonic system is software switchable between 60 kHz & 100 kHz to allow best adaptation to different bonding surfaces.
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User interface is via a colour display and shuttle-wheel making programming of the machine very easy.
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Parameters can be saved to the internal hard disc drive.
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The 53xx BDA software boasts several operating modes from a fully manual step-by-step mode to a production mode where the operator only has to move to the bond positions and then pushes a single button. Only a minimum of training is required.
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The 53xx BDA was already a marvel of versatility, being extremely simple to convert between wedge and ball bonding. Now it adds a third functionality; the 53xx BDA is now capable of DIE bonding. Scroll down.
Only
a minimum of changes in hardware and software
are required. In place of the wire bond tool an
adapter is attached directly to the transducer
in order to mount standard tools for chip
bonding, so-called DIE collets. These are
available from a variety of suppliers in
different shank diameters, all of which fit into
the three mounting holes. The chips are supplied
in waffle packs which can be mounted right next
to the standard bonding chuck.
A
special software version makes DIE-bonding on
the 53xx BDA just as straightforward and
comfortable as wire bonding. Step one is to
shift the bonding chuck sideways so that the
waffle pack with the desired DIE comes to sit
just under the DIE collet. Just like for wire
bonding, the user does a fine adjustment under
the microscope with the manipulator. Step two is
to lower the bond tool onto the chip where a
touchdown signal is registered and the vacuum is
switched on automatically which sucks the chip
to the DIE collet. Using this touchdown
procedure makes sure that the chip is touched
with a defined force – a particularly important
feature for sensitive or thin DIE.
Step
three takes place after the bond tool with the
chip has moved up: the circuit is shifted back
under the bond tool and adjusted precisely,
still using the microscope. The final step
consists of automatic, motorized lowering of the
chip, again under touchdown control, and pushing
the chip into the prepared adhesive bed under a
defined and programmable bond force and bond
time. At this crucial process step, the 53xx BDA
is actually superior to many fully automatic DIE
bonders because it can apply a defined bond
force and time and therefore make sure that even
fragile chips are bonded delicately but over the
full area. This works even when the heights of
the components vary, thanks to the touchdown
feature.