Model 5100

High Production

          Programmable Vacuum/Pressure Furnace

 

The 5100 is the newest member of the furnace range from SST International. Advanced technology allows customers to achieve the highest level of component attachment, and the elimination of voids without the use of flux, for high reliability microelectronic package assembly.

Increased Thermal Work Zone

Typical Applications

  • Fluxless Soldering

  • MMIC Die Attach

  • Power Module Assembly

  • Automotive Device Assembly

  • Hermetic Package Sealing

  • Fiber Optic Packaging

  • Hybrid Assembly

  • High Intensity LED Attach

  • Eutectic Die Attach

  • PV Solar Cell Assembly

  • Flip Chip Soldering

  • Lead-Free Soldering

 

Selected Options

  • Oil-Sealed or Dry Vacuum Pump

  • Multiple Temperature Zone Measurement

  • Moisture and Oxygen Analyzers

  • Illuminated Chamber Viewport

  • Additional Process Gas Input

  • Enhanced Control System with Data Logging

  • Rapid Cooling System

  • Various Heated Target Plate Materials

  • Custom Component Fixtures

  • Cooling Water Recirculator

  • Castors

  • Light Tree

  • Colour Inkjet Printer

 

Specification
Operating Temperature Range: 100°C - 450°C
Thermal Work Zone: 12 x 12 in = 144 in2 (30.5 x 30.5 cm = 930 cm2)
Minimum Vacuum Level: 10 mTorr (.013 mbar)
Maximum Chamber Gas Pressure Level: 40 psig (3.7 bar)
Process Gases (three inputs): N2 required, (Ar; He, forming gas optional) @ 90 psig (7bar) minimum pressure
Electrical Service: 208-240 volts, 50/60 Hz, three phase, 50 amps, 5 kW average, 20 kW maximum
Cooling Water Required: 2 GPM (8 lpm) @ 20-25 °C, 2 kW minimum, 30 psig (3 bar) pressure differential
Work Surface Height: 39" (99cm)
Overall Size ( W x D x H): 43 x 34 x 55 in (108 x 86 x 140 cm)
Weight: 1000 lb (455 kg)

Model 5100 Product Brochure (PDF)

Top of Page

© PDP Equipment Ltd 2012