Tresky

T-4909

Manual Die Bonder

T-3000 & T-3002

Manual Die Bonder

T-3202

Semi-Automatic Die Bonder

T-6000

Automatic Die Bonder

The T-4909 is a manual, high quality die bonder with superior ergonomic design.

As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3000 / T-3002 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industry's most advanced applications by adding a wide range of available options.

As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

The T-3202 represents a new generation of Windows operated, electronic assembly equipment, featuring the highest possible flexibility and enabling a cost effective solution of a broad variety of applications.

As with all of Tresky’s products, this semi automatic die bonder, incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3202 is equipped with Tresky's die ejector system for pick-up from wafer.

The T-6000 Die Bonder is an all purpose system for R&D, pilot and medium size production. Die handling is from Wafer, Waffle-Pack and Gel-Pack as standard.

Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.

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